Releasing and post-releasing processes in fabrications for micromirror array devices
US8395837B2 · kind B2 · utility
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2References
12Claims
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Key dates
| Filing date | Apr 12, 2007 |
| Grant date | Mar 12, 2013 |
| Priority date | — |
| Expiry date | Aug 14, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02164
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A releasing and post-releasing method for making a micromirror device and a micromirror array device are disclosed herein. The releasing method removes the sacrificial materials in the micromirror and micromirror array so as to enabling movements of the movable elements in the micromirror and micromirror array device. The post-releasing method is applied to improve the performance and quality of the released micromirrors and micromirror array devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.