All-in-one computer
US8395890B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 30, 2010 |
| Grant date | Mar 12, 2013 |
| Priority date | — |
| Expiry date | Aug 6, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/1631
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A computer includes an enclosure, and a mainframe module enclosed in the enclosure. The mainframe module includes a base board defining a motherboard, a plurality of drive devices, a heat sink device and a fan thereon. The heat sink device includes a heat sink having a plurality of fins and a heat pipe. The base board is divided into a first part and a second part. The motherboard is located in the first part, and the drive devices are located in the second part. The fan is located between the first and second parts. The heat pipe transmits heat from a heat source on the motherboard to the plurality of fins. The fan blows air to the plurality of fins to cool the heat source on the motherboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.