Controlling warpage in BGA components in a re-flow process
US8397380B2 · kind B2 · utility
1Cited by
9References
15Claims
0Family size
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Key dates
| Filing date | Mar 24, 2010 |
| Grant date | Mar 19, 2013 |
| Priority date | — |
| Expiry date | Sep 16, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an integrated circuit package includes providing a ball grid array (BGA) module including BGA balls on a side of the BGA module; providing a base substrate; and placing the BGA module on the base substrate. The BGA balls are placed between the BGA module and the base substrate. An adhesive is applied between and contacting the BGA module and the base substrate. The adhesive is then cured. The BGA balls are re-flowed after the step of curing the adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.