Patent · US Active

Method and device for the initial measurement of a workpiece, and the processing of a workpiece

US8397394B2 · kind B2 · utility

2Cited by
3References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 1, 2008
Grant dateMar 19, 2013
Priority date
Expiry dateAug 2, 2029

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG05B19/401
  • WIPO fieldControl
  • WIPO sectorInstruments

Abstract

A method for workpiece levelling includes mounting the workpiece in a machine tool, measuring the position of the workpiece in the mounting and determining a translatory offset xv, yv, zv and a rotatory offset λv, βv, φv of the factual workpiece mounting compared to the ideal mounting from the measurement results and from a workpiece data forming an initial data set related to the ideal mounting, wherein for obtaining another initial data set a plurality of surface points of the mounted workpiece are measured in their position xn, yn, zn in space, the data of one of the initial data sets are varied a plurality of times in accordance with plural translatory and rotatory displacements for obtaining a plurality of varied data sets, from the varied data sets and their base data set the one data set is determined that represents a surface with a lowest deviation measure compared to a surface represented by the other of the initial data sets, and the translatory offset xv, yv, zv and the rotatory offset λv, βv, φv is determined from the translatory and rotatory displacement of the determined data set.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.