Patent · US Active

CMP pad conditioners with mosaic abrasive segments and associated methods

US8398466B2 · kind B2 · utility

26Cited by

267References

10Claims

0Family size

Inventors

Chien-Min Sung · Salt Lake City, US
Michael Sung · Cambridge, US

Key dates

Filing date	Jul 5, 2008
Grant date	Mar 19, 2013
Priority date	—
Expiry date	Aug 18, 2031

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B53/017
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.