Transfer film and method for fabricating a circuit
US8398869B2 · kind B2 · utility
0Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2008 |
| Grant date | Mar 19, 2013 |
| Priority date | — |
| Expiry date | Jan 2, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a circuit includes bonding an electrically conductive layer to a carrier film using an adhesive selected from acrylic polymer and silicone polymer, removing selected portions of the electrically conductive layer from the carrier film to provide a circuit arrangement, and transferring the circuit arrangement from the carrier film to a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.