Method of detecting alignment mark and method of manufacturing printed circuit board
US8399163B2 · kind B2 · utility
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1References
7Claims
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Key dates
| Filing date | Apr 12, 2011 |
| Grant date | Mar 19, 2013 |
| Priority date | — |
| Expiry date | Sep 29, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/166
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
When an alignment mark does not exist within an area of an image obtained by a camera, the coordinate of the alignment mark is calculated based on an identification mark existing in the area of the image and a previously stored positional relationship between the alignment mark and the identification mark. A distance by which a long-sized base material is to be moved for causing the alignment mark to be positioned within the imaging area of the camera is calculated based on the calculated coordinate of the alignment mark, and the long-sized base material is moved by the calculated distance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.