Patent · US Active

Method for laser interference lithography using diffraction grating

US8399184B2 · kind B2 · utility

2Cited by
2References
10Claims
0Family size

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Key dates

Filing dateOct 8, 2008
Grant dateMar 19, 2013
Priority date
Expiry dateSep 21, 2029

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG02B5/1814
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A method for laser interference lithography using a diffraction grating includes (a) forming a photoresist layer on a work substrate to which a repeated fine pattern is to be formed; (b) forming a refractive index matching material layer on the photoresist layer; (c) forming on the refractive index matching material layer a diffraction grating layer having a period of diffraction grating within the range from λ/ng to λ/n0 (λ is a wavelength of laser beam, ng is a refractive index of the diffraction grating, and n0 is a refractive index in the air or in vacuum); and (d) exposing the photoresist layer by means of mutual interference of positive and negative diffracted lights with the same absolute value by inputting a laser beam perpendicularly to the diffraction grating layer. This method allows to realize an interference pattern with higher resolution and to use a laser source with lower coherence.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.