Airgap micro-spring interconnect with bonded underfill seal

US8399296B2 · kind B2 · utility

Assignee

• Palo Alto Research Center Incorporated · US

Inventors

• Christopher L. Chua · San Jose, US
• Bowen Cheng · Atherton, US
• Eugene M. Chow · Fremont, US
• Dirk De Bruyker · Palo Alto, US

Key dates

• Filing date: Oct 9, 2011
• Grant date: Mar 19, 2013
• Expiry date: Oct 9, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/857
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.