Cavity structure comprising an adhesion interface composed of getter material
US8399299B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 6, 2010 |
| Grant date | Mar 19, 2013 |
| Priority date | — |
| Expiry date | Oct 6, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making a structure including at least the steps of: making at least one first portion of at least one getter material against a first substrate or a second substrate, making at least one second portion of at least one getter material against the second substrate when the first portion of getter material is placed against the first substrate, or against the first substrate when the first portion of getter material is placed against the second substrate, and attaching the second substrate to the first substrate by thermocompression of a first part of the first portion of getter material against at least one part of the second portion of getter material, forming at least one cavity delimited by the first substrate and the second substrate, a second part of the first portion of getter material being placed in the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.