Method of manufacturing semiconductor device
US8399302B2 · kind B2 · utility
4Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2011 |
| Grant date | Mar 19, 2013 |
| Priority date | — |
| Expiry date | Jun 28, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18301
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The occurrence of a resin seal failure is suppressed. A molding step is carried out using a lead frame in which there are formed multiple air vent portions for discharging gas in each cavity formed in the upper die of a molding die to outside the cavity. The air vent portions are formed at positions overlapping with the other corner portions, arranged inside a gate portion of the cavity. Each of the air vent portions is led out from the other corner portions of the cavity to outside a clamp area and is extended along sides of the cavity, respectively, in the clamp area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.