Tuning the efficiency in the transmission of radio-frequency signals using micro-bumps
US8399961B2 · kind B2 · utility
8Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2010 |
| Grant date | Mar 19, 2013 |
| Priority date | — |
| Expiry date | Jun 24, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device includes a die including a main circuit and a first pad coupled to the main circuit. A work piece including a second pad is bonded to the die. A first plurality of micro-bumps is electrically coupled in series between the first and the second pads. Each of the plurality of micro-bumps includes a first end joining the die and a second end joining the work piece. A micro-bump is bonded to the die and the work piece. The second pad is electrically coupled to the micro-bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.