Alignment and lead insertion device for an electronic component
US8402640B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 26, 2011 |
| Grant date | Mar 26, 2013 |
| Priority date | — |
| Expiry date | Oct 12, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53265
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An opposing first plate and second plate are slideably disposed with respect to each other using self-aligning plate registration means. Circuit board registration means and component registration means are provided for the initial X-Y alignment and registration of the circuit board and socket contact elements with one or more electrically conductive leads of an electronic component such as a focal plane array (FPA). A non-contact portion is provided on the first plate to eliminate plate contact with the first component surface which may comprise the lens of an FPA. The first and second plates are urged together such that an even, controlled and substantially planar compressive force is applied, permitting the efficient insertion of the electrically conductive leads into the socket contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.