Component bonding using a capillary effect
US8403203B2 · kind B2 · utility
3Cited by
60References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2011 |
| Grant date | Mar 26, 2013 |
| Priority date | — |
| Expiry date | Nov 7, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of attaching a component to a substrate, including providing a component guide attached to a substrate, the component guide having a cavity substantially conforming to contours of a portion of a component, attaching a first solder pad to the component, inserting the component into the guide cavity, providing a second solder pad, offset from the first solder pad and near the cavity, and inserting the component, the component guide and the substrate into an oven heating the solder pads, wherein the component is drawn further into the guide cavity by a capillary effect of the heated solder pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.