Card having embedded security element
US8403230B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2009 |
| Grant date | Mar 26, 2013 |
| Priority date | — |
| Expiry date | Dec 25, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1039
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
The invention relates to a card (1), such as a credit card or ID card, which has several layers laminated with each other, wherein between a first card layer (21) and a second card layer (22) there is embedded a security element (2) which has a plastic or lacquer layer (4) with a relief structure (5). The relief structure has areas (5′, 5″) with different picture elements and produces a visible representation (6) and a hidden representation (7) which can be made visible with aids. The security element is adhesively bonded by adhesive layers (9, 10) to the two card layers (21, 22) between which it is embedded, the adhesives being chosen from the group which consists of physically drying adhesives and adhesives crosslinkable by heat, preferably water-based. Upon use of an adhesive crosslinkable by heat, the crosslinking temperature of the adhesive is lower than the softening temperature of the plastic or the lacquer layer (4) in which there is present the relief structure (5). The invention also relates to a method for manufacturing such a card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.