Rapid film bonding using pattern printed adhesive
US8404071B2 · kind B2 · utility
26Cited by
4References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2007 |
| Grant date | Mar 26, 2013 |
| Priority date | — |
| Expiry date | Jun 22, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2553/02
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Various processes for the creation of a film to film bond using printed patterns of adhesive traces. In some implementations of the process, control of the process including control of the temperature of the adhesive and film to a temperature approaching the heat distortion temperature for the film will vary the strength of the bond from a frangible bond to a bond the tears the film, (a film-tearing bond). Some implementations of the process may be used to produce bonded films at web speed rates that are significantly higher than commercial rates for heat seal processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.