Composition and method relating to a hot melt adhesive
US8404079B1 · kind B1 · utility
4Cited by
29References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2007 |
| Grant date | Mar 26, 2013 |
| Priority date | — |
| Expiry date | May 25, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/11
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention includes a hot melt adhesive composition that includes at least one of an isotactic copolymer of butene-1 and a metallocene catalyzed propylene homopolymer, a tackifying resin, and, optionally, a wax. The adhesive composition initially exhibits adhesion quality and subsequently non-adhesion quality. The invention also includes methods of using the adhesive composition for temporarily bonding substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.