Apparatus to treat a substrate
US8404080B2 · kind B2 · utility
1Cited by
4References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 2006 |
| Grant date | Mar 26, 2013 |
| Priority date | — |
| Expiry date | Apr 26, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3266
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus to treat a substrate includes a processing chamber including a reaction space where a substrate to be treated is placed and a plasma is formed, a ferrite core having a plurality of poles disposed outside the reaction space and a connector facing the reaction space across the plurality of poles and connecting the plurality of the poles each other, a coil winding around the plurality of poles, and an electric power unit supplying electric power to the coil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.