LED package structure

US8405096B2 · kind B2 · utility

Assignee

• ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. · TW

Inventors

• Chien-Min Chen · Baoshan, TW
• Ko-Wei Chien · Hsinchu, TW
• Hung-Chin Lin · Hsinchu, TW

Key dates

• Filing date: Sep 22, 2010
• Grant date: Mar 26, 2013
• Expiry date: Feb 25, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8506

Abstract

An LED package structure includes an LED die, a lead frame and a housing connecting to the lead frame. The LED die is located on a surface of the lead frame. The housing includes an inner face surrounding the LED die. The inner face has a bottom edge connected to the surface of the lead frame, a top edge and a waist line between the bottom edge and top edge. The bottom edge surrounds an area less than an area surrounded by the waist line. The area surrounded by the waist line is less than an area surrounded by the top edge. The inner face has a curved surface between the waist line and the bottom edge.