Component having a silicon carbide coated via

US8405190B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Achim Trautmann · Leonberg, DE
• Thorsten Mueller · Reutlingen, DE

Key dates

• Filing date: Oct 20, 2009
• Grant date: Mar 26, 2013
• Expiry date: Oct 20, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A component including a via for electrical connection between a first and a second plane of a substrate is provided. The substrate has a borehole having an inner wall that is coated with a conductive layer made of an electrically conductive material, an intermediate layer being disposed between the inner wall and the conductive layer. The intermediate layer includes electrically insulating SiC.