Chips having rear contacts connected by through vias to front contacts
US8405196B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2008 |
| Grant date | Mar 26, 2013 |
| Priority date | — |
| Expiry date | May 24, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plurality of first conductive contacts at the front surface connected to the device. A plurality of conductive vias may extend from the rear surface through the thin region of the semiconductor element to the first conductive contacts. A plurality of second conductive contacts can be exposed at an exterior of the semiconductor element. A plurality of conductive traces may connect the second conductive contacts to the conductive vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.