Stress-engineered interconnect packages with activator-assisted molds
US8405198B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2009 |
| Grant date | Mar 26, 2013 |
| Priority date | — |
| Expiry date | Mar 23, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, a chemical activator in the interconnect area, and an adhesive responsive to the chemical activator in the interconnect area. A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, a chemical activator on one of either the pad chip or the spring chip, and an adhesive responsive to the chemical activator on the other of either the pad chip or the spring chip. A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.