Power-electronic arrangement
US8405992B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2010 |
| Grant date | Mar 26, 2013 |
| Priority date | — |
| Expiry date | Apr 30, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A power-electronic arrangement comprising semiconductor components (102, 103, 107), a heat exchanger (110), and an electrically conductive element (109) is presented. The heat exchanger comprises evaporator channels (111) and condenser channels (112) for working fluid. The electrically conductive element comprises a contact surface providing a thermal contact to outer surfaces of walls of the evaporator channels for transferring heat from the electrically conductive element to the evaporator channels. A main current terminal of each semiconductor component is bonded to the electrically conductive element which thus forms a part of a main current circuitry of a power system. As the main current terminal is directly bonded to the electrically conductive element cooled with the heat exchanger, the temperature gradients inside the semiconductor components can be kept moderate, and thus the temperatures inside the semiconductor components can be limited.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.