Electronic housing, assemblies therefor and methods of making same
US8406001B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 25, 2010 |
| Grant date | Mar 26, 2013 |
| Priority date | — |
| Expiry date | Jan 8, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic housing is provided comprising a first cover assembly combinable with a second cover assembly to house or enclose a printed circuit board therebetween. Each cover assembly includes a cover and a frame, the cover attachable to the frame by bending portions of the cover thereabout. The cover is preferably stamped metal and the frame is preferably injection molded plastic. Each cover may include recesses such that, when the cover is bent around the frame, the cover bends at the recesses and closely engages the frame on multiple mating surfaces. The cover assemblies may be welded together, such as by ultrasonic welding, to form a complete package or housing, and may include intermittingly spaced shear weld features to improve bond strength therebetween. Methods of manufacturing and/or assembling electronic housings and cover assemblies are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.