Miniature microphone assembly with solder sealing ring
US8406437B2 · kind B2 · utility
2Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2009 |
| Grant date | Mar 26, 2013 |
| Priority date | — |
| Expiry date | Nov 21, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/0257
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a miniature microphone assembly comprising a capacitive microphone transducer comprising a microphone electrical contact or terminal, a microphone carrier comprising a carrier electrical contact or terminal formed on a first surface thereof, and an integrated circuit die comprising a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a first electrically conductive path surrounding the carrier electrical contact or terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.