Patent · US Active

Implementing sequential segmented interleaving algorithm for enhanced process control

US8406911B2 · kind B2 · utility

1Cited by
14References
20Claims
0Family size

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Inventors

Key dates

Filing dateJul 16, 2010
Grant dateMar 26, 2013
Priority date
Expiry dateFeb 25, 2031

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P90/80
  • WIPO fieldControl
  • WIPO sectorInstruments

Abstract

A method and apparatus are provided for implementing Advanced Process Control (APC) for enhanced electrical, magnetic, or physical properties process output control using a sequential segmented interleaving algorithm. The sequential segmented interleaving algorithm includes two tuning equations running in parallel. A deposition time is calculated after a production run based upon the relationship between the electrical, magnetic, or physical properties process output and deposition time process input. A deposition rate offset value is calculated after a calibration run based upon the relationship between a calibration deposition thickness process output and an updated deposition time process input calculated after a last production run.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.