Method for manufacturing a module with a hollow area by hot isostatic compression
US8408447B2 · kind B2 · utility
1Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2010 |
| Grant date | Apr 2, 2013 |
| Priority date | — |
| Expiry date | Sep 23, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing a module with a hollow area by hot isostatic compression, including: making an assembly including superposed elements defining the hollow area, the assembly forming a sealed casing containing the hollow area, including at least one meltable obturation member separating the hollow area from the outside of the assembly; followed by hot isostatic compression of the assembly, to obtain diffusion-welding of its elements, by letting temperature and pressure conditions change over time to cause a rupture of the meltable obturation member allowing pressurization gas to penetrate into the hollow area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.