Skin wound healing compositions and methods of use thereof
US8410055B2 · kind B2 · utility
3Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2011 |
| Grant date | Apr 2, 2013 |
| Priority date | — |
| Expiry date | Aug 15, 2031 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61L2300/412
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
A wound healing composition comprising an amount of heat shock protein effective to promote wound healing and a method thereof to apply the composition. A preferred heat shock protein is either full-length hsp90α or the middle domain plus the charged sequence of hsp90α. The composition is topically applied to skin wounds, covering the outer surface of the wound. The heat shock protein acts by promoting migration of both human epidermal keratinocyte and dermal fibroblasts to the wound in order to close, heal, and remodel the wound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.