Printed wiring board
US8410374B2 · kind B2 · utility
2Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2009 |
| Grant date | Apr 2, 2013 |
| Priority date | — |
| Expiry date | May 2, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring board has an insulative board having a first surface and a second surface on the opposite side of the first surface, a wiring formed on the first surface of the insulative board and having a pad and a conductive circuit contiguous to the pad, and a metal film formed on the pad. The pad is provided to mount an electronic component having a gold bump. The pad has a thickness which is greater than a thickness of the conductive circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.