Manufacturing method and structure of LED chip
US8410487B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2011 |
| Grant date | Apr 2, 2013 |
| Priority date | — |
| Expiry date | Dec 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/018
Abstract
A manufacturing method and a structure of a light-emitting diode (LED) chip are disclosed. The method includes the steps of: providing a conductive block; providing an epitaxial block; bonding; removing an epitaxial substrate; making independent LEDs; forming a dielectric layer; and making electrical connection. A first LED, a second LED, and a third LED are formed on the conductive block, wherein the first and second LEDs are electrically connected in series, and the second and third LEDs are electrically connected in parallel. Thus, a basic unit with a flexible design of series- and parallel-connected LEDs can be formed to increase the variety and application of LED chip-based designs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.