Light emitting diode coating method
US8410517B2 · kind B2 · utility
1Cited by
5References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2009 |
| Grant date | Apr 2, 2013 |
| Priority date | — |
| Expiry date | May 5, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a light emitting diode (hereinafter, referred to as an LED) coating method, and more particularly, an LED coating method that can be used to coat a phosphor, a molding, etc., on an LED.The LED coating method includes (a) preparing a substrate and a plurality of LEDs arranged on the substrate; (b) applying a photoresist onto the substrate and the plurality of LEDs; and (c) selectively exposing the photoresist to light to form a first coating on surfaces of the plurality of LEDs. Here, the first coating is formed by curing the photoresist.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.