Methods and apparatus for temperature control of devices and mechanical resonating structures
US8410868B2 · kind B2 · utility
20Cited by
32References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 17, 2010 |
| Grant date | Apr 2, 2013 |
| Priority date | — |
| Expiry date | Jul 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2009/241
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for temperature control of devices and mechanical resonating structures are described. A mechanical resonating structure may include a heating element and a temperature sensor. The temperature sensor may sense the temperature of the mechanical resonating structure, and the heating element may be adjusted to provide a desired level of heating. Optionally, additional heating elements and/or temperature sensors may be included.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.