System, apparatus and method for tiered shock solution
US8411432B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2009 |
| Grant date | Apr 2, 2013 |
| Priority date | — |
| Expiry date | Apr 17, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/1658
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of a tiered damping solution to protect a computer system from shock are disclosed. More specifically, in one embodiment at an external level the computer system may be protected from a shock and vibration by the use of dampeners which may be located on the chassis of the computer system to cover possible contact points. The devices are isolated from remaining shock or vibration by utilizing isolating materials at points where the device mounts to, or otherwise contacts, the chassis. Within the device itself another tier of protection may serve to protect components within a device by isolating the components from the points at which the component mounts to, or otherwise contacts, the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.