Mounting structure and motor
US8411455B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2010 |
| Grant date | Apr 2, 2013 |
| Priority date | — |
| Expiry date | Mar 14, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A mounting structure 1 in which an electronic component 5 is surface-mounted with solder 4 to a wiring substrate 2 is disclosed. The solder is Sn—Ag—Bi—In-based solder containing 0.1% by weight or more and 5% by weight or less of Bi, and more than 3% by weight and less than 9% by weight of In, with the balance being made up of Sn, Ag and unavoidable impurities. The wiring substrate has a coefficient of linear expansion of 13 ppm/K or less in all directions. Thus, it is possible to realize a mounting structure using lead-free solder and for which the occurrence of cracks in a solder joint portion due to a 1000-cycle thermal shock test from −40 to 150° C. has been suppressed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.