Semiconductor laser device
US8411715B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2008 |
| Grant date | Apr 2, 2013 |
| Priority date | — |
| Expiry date | Nov 19, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/06825
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention relates to a semiconductor laser device comprising a laser bar (2), a flexible conductor support (10), a supporting body (3) of a metal or a metal alloy and a heat sink (4), which is arranged between the supporting body (3) and the laser bar (2), the laser bar (2) being electrically contacted by the flexible conductor support (10) and the supporting body (3) having a thickness of at least 2 mm. The invention further relates to a method for producing the above-described semiconductor laser device, wherein a synchronous soldering process is used to solder the laser bar (2) to the heat sink (4) by means of a hard solder layer (30) and the heat sink (4) to the supporting body (3) by means of a further hard solder layer (31).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.