Method for bonding a wire conductor laid on a substrate
US8413316B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2008 |
| Grant date | Apr 9, 2013 |
| Priority date | — |
| Expiry date | Aug 12, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method for bonding a wire conductor arranged on a preferably card-like substrate during the manufacture of a transponder unit having a wire coil and a chip module, comprising a first phase, wherein the coil is permanently joined with the substrate, and a second phase, wherein the wire conductor and the chip module are bonded, whereas in the first phase at least one of the end portions of the wire conductor intended for later bonding with the chip module is attached to the substrate with a free loop being formed, and that the loop thus formed is gripped in a second phase and a section of the loop is then bonded with a bonding area of the chip module and attached to it in an electronically conductive manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.