Plasma processing apparatus
US8414702B2 · kind B2 · utility
0Cited by
14References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 7, 2011 |
| Grant date | Apr 9, 2013 |
| Priority date | — |
| Expiry date | May 10, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32458
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing apparatus is described and which includes a chamber having at least two processing stations which are separated by a wall. At least one channel is formed in the wall, and wherein the channel has a width to length ratio of less than about 1:3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.