Methods for fabrication of microfluidic systems on printed circuit boards
US8414785B2 · kind B2 · utility
5Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2009 |
| Grant date | Apr 9, 2013 |
| Priority date | — |
| Expiry date | Sep 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0285
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods for fabrication of microfluidic systems on printed circuit boards (PCB) are described. The PCB contains layers of insulating material and a layer or layers of metal buried within layers of insulating material. The metal layers are etched away, leaving fully enclosed microfluidic channels buried within the layers of insulating material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.