Microcontact printed thin film capacitors
US8414962B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2005 |
| Grant date | Apr 9, 2013 |
| Priority date | — |
| Expiry date | Aug 24, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/306
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention relates to thin film single layers, electronic components such as multilayer capacitors which utilize thin film layers, and to their methods of manufacture. Chemical solution deposition and microcontact printing of dielectric and electrode layers are disclosed. High permittivity BaTiO3 multilayer thin film capacitors are prepared on Ni foil substrates by microcontact printing and by chemical solution deposition. Multilayer capacitors with BaTiO3 dielectric layers and LaNiO3 internal electrodes are prepared, enabling dielectric layer thicknesses of 1 μm or less. Microcontact printing of precursor solutions of the dielectric and electrode layers is used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.