Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method
US8415784B2 · kind B2 · utility
3Cited by
1References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 28, 2010 |
| Grant date | Apr 9, 2013 |
| Priority date | — |
| Expiry date | Mar 1, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a plurality of stacked substrates. Each of the substrates includes a semiconductor substrate, a columnar conductor, and a ring-shaped insulator. The columnar conductor extends along a thickness direction of the semiconductor substrate. The ring-shaped insulator includes an inorganic insulating layer mainly composed of a glass. The inorganic insulating layer fills a ring-shaped groove that is provided in the semiconductor substrate to surround the columnar conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.