Integrated circuits having interconnects and heat dissipators based on nanostructures
US8415787B2 · kind B2 · utility
11Cited by
14References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 21, 2012 |
| Grant date | Apr 9, 2013 |
| Priority date | — |
| Expiry date | May 21, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/86
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a heat dissipator that includes a conductive substrate and a plurality of nanostructures supported by the conductive substrate. The nanostructures are at least partly embedded in an insulator. Each of the nanostructures includes a plurality of intermediate layers on the conductive substrate. At least two of the plurality of intermediate layers are interdiffused, and material of the at least two of the plurality of intermediate layers that are interdiffused is present in the nanostructure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.