Identification of dies on a semiconductor wafer
US8415813B2 · kind B2 · utility
8Cited by
18References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2011 |
| Grant date | Apr 9, 2013 |
| Priority date | — |
| Expiry date | Jun 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor wafer includes multiple dies and a die identification region adjacent to or on each die. The die identification region can include a wafer indicator and a pattern of die locations representing die locations on the wafer. A die identification marker is provided in each pattern of die locations in the die identification region specifying a location of a respective die on the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.