Thick single-lens extended depth-of-field imaging systems
US8416334B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 27, 2010 |
| Grant date | Apr 9, 2013 |
| Priority date | — |
| Expiry date | Jun 24, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B13/0025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An extended depth of field (EDOF) imaging system (10) is disclosed that has an optical system (20) consisting of a single lens element (22) having a focal length (F), a thickness (TH) between 0.25F and 1.2F, and an objectwise aperture stop (AS). The optical system has a select amount of spherical aberration (SA) that allows for correcting coma by positioning the aperture stop. The optical system has an amount of field curvature (FC) such that 20 microns≦FC≦300 microns, which is made possible by the thickness of the single lens element. The imaging system has an image sensor (30) and an image processing unit (54) adapted to process raw images to form contrast-enhanced images.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.