Method and system for high-speed, high-resolution 3-D imaging of manufactured parts of various sizes
US8416403B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 29, 2010 |
| Grant date | Apr 9, 2013 |
| Priority date | — |
| Expiry date | Oct 28, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/952
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and system for high-speed, high-resolution 3-D imaging of manufactured parts of various sizes at an imaging station having a measurement axis are provided. The part has a 3-D end surface and a length, a width and a part axis defined as being central to the part and parallel to its length. The system includes apparatus having a central axis substantially parallel to the measurement axis and a plurality of members having open and closed positions. The members have holding faces which are substantially equidistant from the central axis during movement between the positions to align a part disposed between the holding faces at the station so that the part axis is substantially parallel to the measurement and central axes. The holding faces releasably hold the aligned part in a holding position between the positions. The system further includes an actuator for moving the apparatus so that the end surface moves in a plane substantially perpendicular to the measurement axis. The system still further includes a controller for controlling the actuator to move the end surface along a 2-D trajectory within the plane. The system further includes at least one sensor for emitting a beam…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.