System and method for simulated linearization of curved surface
US8417004B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 7, 2011 |
| Grant date | Apr 9, 2013 |
| Priority date | — |
| Expiry date | Jul 5, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2219/021
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In accordance with embodiments of the present disclosure, a method may include mapping an ellipse with its center at the origin of an xy-coordinate plane to a circle with its center at the origin of the xy-coordinate plane. The method may also include transforming a three-dimensional subject image including a curved profile in the xy-coordinate plane to an intermediate image based at least on the mapping of the ellipse to a base circle. The method may further include transforming the intermediate image to a transformed image having a linear profile by distorting each of one or more points of interest of the intermediate image based at least on a dimension of the circle and a coordinate of such point.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.