Apparatus with temperature self-compensation and method thereof
US8419271B2 · kind B2 · utility
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12References
20Claims
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Key dates
| Filing date | May 27, 2010 |
| Grant date | Apr 16, 2013 |
| Priority date | — |
| Expiry date | Jul 2, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N29/022
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for compensating a thermal effect is provided and includes a substrate structure and a microcantilever. The substrate structure includes a first piezoresistor. The first piezoresistor is buried in the substrate structure and has a first piezoresistance having a first relation to a first variable temperature. The microcantilever has the thermal effect and a second piezoresistance having a second relation to the first variable temperature, wherein the thermal effect is compensated based on the first and the second relations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.