Sintered body, sputtering target and molding die, and process for producing sintered body employing the same
US8419400B2 · kind B2 · utility
5Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2006 |
| Grant date | Apr 16, 2013 |
| Priority date | — |
| Expiry date | Jun 5, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/266
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Provided is an apparatus that includes a molding die for producing a sintered body. The molding die is configured for cold isostatic pressing and includes a knockdown mold frame comprised of plural frame members and a bottom plate provided in contact with the knockdown mold frame. An upper punch is provided to be movable along the inner surface of the knockdown mold frame. The frame members configured to be movable relative to each other to accommodate an expansion of a green body which takes place at the time of reducing the pressure after the completion of pressing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.