Wiring substrate and method for manufacturing wiring substrate
US8419924B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2010 |
| Grant date | Apr 16, 2013 |
| Priority date | — |
| Expiry date | Nov 5, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1147
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
[Subject Matter] To provide a method for manufacturing a wiring substrate where rigidity is enhanced in an insulative portion made by oxidizing aluminum.[Solution(s)] Aluminum oxide insulative portion 24 is formed on aluminum plate 20 as shown in FIG. 1(A) through anodic oxidation (FIG. 1(C)). Then, holes (nano-holes) (24h) in aluminum oxide 24 are filled with resin 30 (FIG. 1(E)). Accordingly, the rigidity (strength) of insulative portion 24 will be enhanced and cracking will not occur during heat cycles. Also, the insulation reliability of aluminum oxide will increase, and short circuiting may be prevented at through holes 26 (aluminum portions) separated by aluminum oxide 24.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.