Hair or skin conditioning compositions comprising hydrophobically modified amido silicone copolyol
US8420065B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2006 |
| Grant date | Apr 16, 2013 |
| Priority date | — |
| Expiry date | Dec 17, 2029 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61K2800/594
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
Disclosed are hair or skin conditioning compositions comprising by weight: (a) from about 0.1% to about 10% of a thickening polymer system; (b) from about 0.1% to about 8.0% of a surfactant system selected from the group consisting of cationic surfactant, nonionic surfactant, and mixtures thereof; (c) from about 0.1% to about 10% of a hydrophobically modified amido silicone copolyol; and (d) an aqueous carrier; wherein the composition has a transmittance of 25% or more and/or wherein the composition has a viscosity of from about 1,000 cps to about 50,000 cps and Shear Thinning Index of 30 or more. The compositions are especially suitable for hair care products such as hair conditioning products for rinse-off/leave-on use.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.