Semiconductor device and method for manufacturing a semiconductor device
US8421214B2 · kind B2 · utility
2Cited by
18References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2007 |
| Grant date | Apr 16, 2013 |
| Priority date | — |
| Expiry date | Dec 11, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device mountable to a substrate is provided. The device includes a semiconductor package having at least one semiconductor die, an electrically conductive attachment region, and a packaging material in which is embedded the semiconductor die and a first portion of the electrically conductive attachment region contacting the die. A metallic shell encloses the embedded semiconductor die and the first portion of the electrically conductive attachment region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.